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STA369BWS 数据表(PDF) 88 Page - STMicroelectronics |
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STA369BWS 数据表(HTML) 88 Page - STMicroelectronics |
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88 / 92 page  Package thermal characteristics STA369BWS 88/92 DocID016861 Rev 7 9 Package thermal characteristics Using a double-layer PCB the thermal resistance, junction to ambient, with 2 copper ground areas of 3 x 3 cm2 and with 16 via holes is 24 °C/W in natural air convection. The dissipated power within the device depends primarily on the supply voltage, load impedance and output modulation level. Thus, the maximum estimated dissipated power for the STA369BWS is: Figure 31 shows the power derating curve for the PowerSSO-36 package on PCBs with copper areas of 2 x 2 cm2 and 3 x 3 cm2. Figure 31. PowerSSO-36 power derating curve 2 x 20 W @ 8 , 18 V Pd max is approximately 4 W 2 x 9 W + 1 x 20 W @ 4 , 8 ,18 V Pd max is approximately 5 W STA369BWS PowerSSO- |
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