TLV9152SIRUGR datasheet(9/77 Pages) TI

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6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

Supply voltage, VS = (V+) – (V–)

Signal input pins

Common-mode voltage (3)

(V–) – 0.5

(V+) + 0.5

Differential voltage (3)

VS + 0.2

Current (3)

–10

Output short-circuit (2)

Continuous

Operating ambient temperature, TA

–55

150

°C

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Short-circuit to ground, one amplifier per package.

(3)

Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5 V beyond the supply rails must be

current limited to 10 mA or less.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged device model (CDM), per JEDEC specification JESD22-C101 (2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, (V+) – (V–)

2.7

Input voltage range

(V–) – 0.1

(V+) + 0.1

VIH

High level input voltage at shutdown pin (amplifier disabled)

1.1

(V+)

VIL

Low level input voltage at shutdown pin (amplifier enabled)

(V–)

0.2

Specified temperature

–40

125

°C

6.4 Thermal Information for Single Channel

THERMAL METRIC (1)

TLV9151, TLV9151S

UNIT

DBV

(SOT-23)

DCK

(SC70)

5 PINS

6 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

185.7

167.8

202.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

108.2

107.9

101.5

°C/W

RθJB

Junction-to-board thermal resistance

54.5

49.7

47.8

°C/W

ψJT

Junction-to-top characterization parameter

31.2

33.9

18.8

°C/W

ψJB

Junction-to-board characterization parameter

54.2

49.5

47.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

www.ti.com

TLV9151, TLV9152, TLV9154

SBOS986E – OCTOBER 2019 – REVISED JANUARY 2022

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