LTC4367 datasheet(23/30 Pages) AD

23 / 30 page

LTC7000A

Rev. 0

For more information www.analog.com

APPLICATIONS INFORMATION

PC Board Layout Considerations

1. Solder the exposed pad on the backside of the

LTC7000A/LTC7000A-1 packages directly to the

ground plane of the board.

2. Kelvin connect the SNS+ pin to the current sense

resistor.

3. Limit the resistance of the TS trace, by making it short

and wide.

4. CB needs to be close to chip.

5. Always include an option in the PC board layout to

place a resistor in series with the gate of any exter-

nal MOSFET. High frequency oscillations are design

dependent and having the option to add a series damp-

ening resistor can save a design iteration of the PC

board.

Pin Creepage and Clearance

In some higher voltage applications, the MSE16 package

may not provide sufficient PC board trace clearance

between high and low voltage pins. In applications where

clearance is required, the LTC7000A-1 in the MSE16(12)

package can be used. The MSE16(12) package has

removed pins between all the adjacent high voltage

and low voltage pins, providing 0.657mm clearance,

which will be sufficient for most applications. For more

information, refer to the printed circuit board design

standards described in IPC-2221.

LTC4367 数据表(PDF) 23 Page - Analog Devices