数据搜索系统，热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

预览 PDF HTML

ADM7154ACPZ-1.2-R7 数据表(PDF) 20 Page - Analog Devices

部件名 ADM7154ACPZ-1.2-R7
功能描述  600 mA, Ultralow Noise, High PSRR, RF Linear Regulator
PDF  23 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADM7154ACPZ-1.2-R7 数据表(HTML) 20 Page - Analog Devices

Back Button ADM7154ACPZ-1.2-R7 Datasheet HTML 15Page - Analog Devices ADM7154ACPZ-1.2-R7 Datasheet HTML 16Page - Analog Devices ADM7154ACPZ-1.2-R7 Datasheet HTML 17Page - Analog Devices ADM7154ACPZ-1.2-R7 Datasheet HTML 18Page - Analog Devices ADM7154ACPZ-1.2-R7 Datasheet HTML 19Page - Analog Devices ADM7154ACPZ-1.2-R7 Datasheet HTML 20Page - Analog Devices ADM7154ACPZ-1.2-R7 Datasheet HTML 21Page - Analog Devices ADM7154ACPZ-1.2-R7 Datasheet HTML 22Page - Analog Devices ADM7154ACPZ-1.2-R7 Datasheet HTML 23Page - Analog Devices  
Zoom Inzoom in Zoom Outzoom out
 20 / 23 page
background image
ADM7154
Data Sheet
Rev. B | Page 20 of 23
TOTAL POWER DISSIPATION (W)
1.8
2.0
2.2
2.4
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
60
70
80
90
100
110
120
130
160
150
140
6400mm2
500mm2
25mm2
TJ MAX
Figure 59. Junction Temperature vs. Total Power Dissipation for
the 8-Lead SOIC, TA = 50°C
TOTAL POWER DISSIPATION (W)
2.0
1.6
1.8
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
65
75
85
95
105
115
125
135
155
145
6400mm2
500mm2
25mm2
TJ MAX
Figure 60. Junction Temperature vs. Total Power Dissipation for
the 8-Lead SOIC, TA = 85°C
Thermal Characterization Parameter (ΨJB)
When board temperature is known, use the thermal
characterization parameter, ΨJB, to estimate the junction
temperature rise (see Figure 61 and Figure 62). Maximum
junction temperature (TJ) is calculated from the board
temperature (TB) and power dissipation (PD) using the following
formula:
TJ = TB + (PD × ΨJB)
(5)
The typical value of ΨJB is 15.1°C/W for the 8-lead LFCSP
package and 17.9°C/W for the 8-lead SOIC package.
TOTAL POWER DISSIPATION (W)
9.0
8.5
8.0
7.0
6.0
7.5
6.5
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
160
140
120
100
80
60
40
20
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
Figure 61. Junction Temperature vs. Total Power Dissipation for
the 8-Lead LFCSP
TOTAL POWER DISSIPATION (W)
5.5
7.5
7.0
6.5
6.0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
160
140
120
100
80
60
40
20
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
Figure 62. Junction Temperature vs. Total Power Dissipation for
the 8-Lead SOIC



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com