LTM4658

2

Rev. 0

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PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

PGOOD......................................................... –0.3V to 6V

RUN, SSTT, MODE/SYNC,

Operating Junction Temperature

(Note 2) ............................................. –40°C to 125°C

Storage Temperature Range .................. –55°C to 125°C

Peak Solder Reflow Body Temperature ................. 245°C

(Note 1)

LGA PACKAGE

25-LEAD (4mm × 4mm × 4.32mm)

WEIGHT = 0.22g

TOP VIEW

RUN

AGND

FREQ

SSTT

PGOOD

A

5

1

2

3

4

FB

COMP

B

C

D

E

GND

MODE/SYNC

SW

ORDER INFORMATION

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LTM4658EV#PBF

Au (RoHS)

4658

4LTV

4

LGA

4

–40°C to 125°C

LTM4658IV#PBF

• Contact the factory for parts specified with wider operating temperature

ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures

• LGA and BGA Package and Tray Drawings

(See Pin Functions, Pin Configuration Table)

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Input DC Voltage

l

2.25

5.5

V

Output Voltage Range

l

0.5

V

Output Voltage

0.5

0.5075

V

2.0

2.1

2.2

V

150

mV

RUN Pin On Threshold

0.375

0.4

0.425

V

RUN Pin Hysteresis

60

mV

RUN Pin Leakage Current

RUN = 0.4V

±200

nA

l

denotes the specifications which apply over the specified operating