ADL6010

Data Sheet

Rev. E | Page 8 of 23

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

NOTES

1. EXPOSED PAD. THE EXPOSED PAD (EPAD) ON THE UNDERSIDE OF THE DEVICE

IS ALSO INTERNALLY CONNECTED TO GROUND AND REQUIRES GOOD THERMAL

AND ELECTRICAL CONNECTION TO THE GROUND OF THE PRINTED CIRCUIT BOAR

CONNECT ALL GROUND PINS TO A LOW IMPEDANCE GROUND PLANE

TOGETHER WITH THE EPAD.

6

COMM

4

VPOS

5

VOUT

1

RFCM

3

RFCM

2

RFIN

ADL6010

TOP VIEW

(Not to Scale)

Figure 2. 6-Lead LFCSP Pin Configuration

ADL6010

TOP VIEW

(CIRCUIT SIDE)

(Not to Scale)

4

6

1

5

RFCM

RFCM

RFIN

2

3

COMM

VOUT

VPOS

Figure 3. 6-Pad Bare Die Pin Configuration

Table 3. Pin Function Descriptions

Pin No.

Mnemonic

Description

1

COMM

Device Ground. Connect COMM to the system ground using a low impedance ground plane together with the

exposed pad (EPAD).

2

VOUT

Output Voltage. The output from the VOUT pin is proportional to the envelope value at the RFIN pin.

3

VPOS

Supply Voltage. The operational range is from 4.75 V to 5.25 V. Decouple the power supply using the suggested

capacitor values of 100 pF and 0.1 µF and locate these capacitors as close as possible to the VPOS pin.

4, 6

RFCM

Device Grounds. Connect the RFCM pins to the system ground using a low impedance ground plane together

with the exposed pad (EPAD).

5

RFIN

Signal Input. The RFIN pin is ac-coupled and has an RF input impedance of approximately 50 Ω.

Exposed Pad. The exposed pad (EPAD) on the underside of the device is also internally connected to ground and

requires good thermal and electrical connection to the ground of the printed circuit board (PCB). Connect all

ground pins to a low impedance ground plane together with the EPAD.

1

Not applicable for the 6-pad bare die.