ADP1621ARMZ-R7 datasheet(6/32 Pages) AD

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ADP1621

Data Sheet

Rev. D | Page 6 of 32

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

IN to GND

−0.3 V to VSHUNT

FB, COMP, SDSN, FREQ, GATE to GND

−0.3 V to (VIN + 0.3 V)

CS to GND

−5 V to +33 V

PIN to PGND

−0.3 V to VSHUNT

Supply Current into IN

25 mA

Supply Current into PIN

35 mA

Storage Temperature Range

−55°C to +150°C

Junction Operating Temperature Range1

−55°C to +150°C

Junction Storage Temperature Range

−55°C to +150°C

Lead Temperature (Soldering, 10 sec)

300°C

Package Power Dissipation1

(TJ,MAX − TA)/θJA

In applications where high power dissipation and poor package thermal

resistance are present, the maximum ambient temperature may need to be

derated. Maximum ambient temperature (TA,MAX) is dependent on the maximum

operating junction temperature (TJ,MAX = 150oC), the maximum power dissipation

of the device in the application (PD,MAX), and the junction-to-ambient thermal

resistance of the package in the application (θJA), is given by the following

equation: TA,MAX = TJ,MAX – (θJA x PD,MAX).

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all other voltages are

referenced to GND.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

Unit

10-Lead MSOP on a 2-Layer Printed Circuit Board (PCB) 200

°C/W

10-Lead MSOP on a 4-Layer PCB

172

°C/W

Junction-to-ambient thermal resistance of the package is based

on modeling and calculation using 2-layer and 4-layer boards, and

natural convection. The junction-to-ambient thermal resistance is

application- and board-layout dependent. In applications where

high maximum power dissipation exists, attention to thermal

dissipation issues in board design is required.

ESD CAUTION

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