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ADP2503ACPZ-3.3-R7 数据表(PDF) 15 Page - Analog Devices |
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ADP2503ACPZ-3.3-R7 数据表(HTML) 15 Page - Analog Devices |
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15 / 16 page ![]() Data Sheet ADP2503/ADP2504 Rev. D | Page 15 of 16 PCB LAYOUT GUIDELINES Poor layout can affect ADP2503/ADP2504 performance, causing electromagnetic interference (EMI) and electromagnetic compatibility (EMC) performance, ground bounce, and voltage losses. Poor layout can also affect regulation and stability. A good layout is implemented using the following rules: Place the inductor, input capacitor, and output capacitor close to the IC using short tracks. These components carry high switching frequencies and large tracks act like antennas. Route the output voltage path away from the inductor and SW node to minimize noise and magnetic interference. Maximize the size of ground metal on the component side to help with thermal dissipation. Use a ground plane with several vias connecting to the component side ground to further reduce noise interference on sensitive circuit nodes. Figure 31. ADP2503/ADP2504 Evaluation Board for Fixed Output Voltages |
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