ADP5034ACPZ-R2 datasheet(25/28 Pages) AD

25 / 28 page

Data Sheet

ADP5034

Rev. E | Page 25 of 28

PCB LAYOUT GUIDELINES

Poor layout can affect ADP5034 performance, causing electro-

magnetic interference (EMI) and electromagnetic compatibility

(EMC) problems, ground bounce, and voltage losses. Poor

layout can also affect regulation and stability. A good layout is

implemented using the following guidelines. Also, refer to the

UG-271 and UG-439 user guide.

•

Place the inductor, input capacitor, and output capacitor

close to the IC using short tracks. These components carry

high switching frequencies, and large tracks act as antennas.

•

Route the output voltage path away from the inductor and

SW node to minimize noise and magnetic interference.

•

Maximize the size of ground metal on the component side

to help with thermal dissipation.

•

Use a ground plane with several vias connecting to the

component side ground to further reduce noise

interference on sensitive circuit nodes.

•

Connect VIN1, VIN2, and AVIN together close to the IC

using short tracks.

ADP5034ACPZ-R2 数据表(PDF) 25 Page - Analog Devices