Data Sheet

ADP5034

Rev. E | Page 27 of 28

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

0.30

0.25

0.20

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-8.

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

SEATING

PLANE

0.80

0.75

0.70

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

2.20

2.10 SQ

2.00

1

24

7

12

13

18

19

6

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.05 MAX

0.02 NOM

Figure 55. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-24-10)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-153-AET

28

15

14

1

EXPOSED

PAD

(Pins Up)

9.80

9.70

9.60

4.50

4.40

4.30

6.40

BSC

TOP VIEW

BOTTOM VIEW

0.65 BSC

0.15

0.05

COPLANARITY

0.10

1.20 MAX

1.05

1.00

0.80

0.30

0.19

SEATING

PLANE

0.20

0.09

3.05

3.00

2.95

8°

0°

0.75

0.60

0.45

3.55

3.50

3.45

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 55. 28-Lead Thin Shrink Small Outline with Exposed Pad Package [TSSOP_EP]

9.7 mm × 6.4 mm Body, (RE-28-1)

Dimensions shown in millimeters