MPC7410PCPNS datasheet(29/56 Pages) NXP

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MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

Package Description

The following sections provide the package parameters and mechanical dimensions for the MPC7410, 360 CBGA

and 360 HCTE packages.

7.1 Package Parameters for the MPC7410, 360 CBGA and

360 HCTE_CBGA

The package parameters are as provided in the following list. The package types are the 25

× 25 mm, 360-lead

ceramic ball grid array package (CBGA) or the 25

× 25 mm, 360-lead high coefficient of thermal expansion CBGA

package (HCTE_CBGA).

Package outline

× 25 mm

Interconnects

360 (19

× 19 ball array – 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.72 mm

Maximum module height

3.20 mm

Ball diameter

0.89 mm (35 mil)

Coefficient of thermal expansion

6.8 ppm/°C (CBGA)

12.3ppm/°C (HCTE_CBGA)

7.2 Package Parameters for the MPC7410, 360 HCTE_CBGA (Lead

Free C5 Spheres)

The package parameters are as listed here. The package types are the 25

× 25 mm, 360-lead high coefficient of

thermal expansion CBGA package with lead-free C5 spheres (HCTE_CBGA lead-free spheres).

Package outline

× 25 mm

Interconnects

360 (19

× 19 ball array – 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.32 mm

Maximum module height

2.80 mm

Ball diameter

0.76 mm (30 mil)

Coefficient of thermal expansion

12.3ppm/°C

MPC7410PCPNS 数据表(PDF) 29 Page - NXP Semiconductors

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