TSSOP−14 WB

CASE 948G

ISSUE C

DATE 17 FEB 2016

SCALE 2:1

1

14

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present.

DIM MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

4.90

5.10 0.193 0.200

B

4.30

4.50 0.169 0.177

C

−−−

1.20

−−− 0.047

D

0.05

0.15 0.002 0.006

F

0.50

0.75 0.020 0.030

G

0.65 BSC

0.026 BSC

H

0.50

0.60 0.020 0.024

J

0.09

0.20 0.004 0.008

J1

0.09

0.16 0.004 0.006

K

0.19

0.30 0.007 0.012

K1

0.19

0.25 0.007 0.010

L

6.40 BSC

0.252 BSC

M

0

8

0

8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL

IN EXCESS OF THE K DIMENSION AT

MAXIMUM MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

___

_

S

U

0.15 (0.006) T

2X

L/2

S

U

M

0.10 (0.004)

T

L

−U−

SEATING

PLANE

0.10 (0.004)

−T−

SECTION N−N

DETAIL E

J J1

K

K1

DETAIL E

F

M

−W−

0.25 (0.010)

8

14

7

1

PIN 1

IDENT.

H

G

A

D

C

B

S

U

0.15 (0.006) T

−V−

14X

REF

K

N

N

GENERIC

MARKING DIAGRAM*

XXXX

XXXX

ALYWG

G

1

14

A

= Assembly Location

L

= Wafer Lot

Y

= Year

W

= Work Week

G

= Pb−Free Package

7.06

14X

0.36

14X

1.26

0.65

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT

(Note: Microdot may be in either location)

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98ASH70246A

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

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