AX−SFEU, AX−SFEU−API

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18

QFN40 PACKAGE INFORMATION

QFN40 Soldering Profile

Figure 6. QFN40 Soldering Profile

Preheat

Reflow

Cooling

Time

25°C

Table 12.

Profile Feature

Pb−Free Process

Average Ramp−Up Rate

3°C/s max.

Preheat Preheat

Temperature Min

150°C

Temperature Max

200°C

60 – 180 sec

Time 25°C to Peak Temperature

8 min max.

Reflow Phase

Liquidus Temperature

217°C

Time over Liquidus Temperature

60 – 150 s

Peak Temperature

260°C

Time within 5°C of actual Peak Temperature

20 – 40 s

Cooling Phase

Ramp−down rate

6°C/s max.

5. All temperatures refer to the top side of the package, measured on the package body surface.