5

Suggested footprint

The MASTERGAN4 footprint for the PCB layout is usually defined based on several design factors like assembly

plant technology capabilities and board component density. For easy device usage and evaluation, ST provides

the following footprint design, which is suitable for the largest variety of PCBs.

The following footprint indicates the copper area which should be free from the solder mask, while the copper

area is to extend beyond the indicated areas especially for EP2 and EP3. To aid thermal dissipation, it is

recommended to add thermal vias under these EPADs to transfer and dissipate device heat to the other PCB

copper layers. A PCB layout example is available with the MASTERGAN4 evaluation board.

TOP VIEW

Dimensions in mm

MASTERGAN4

Suggested footprint

DB4419 - Rev 1

page 8/14