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ADP5587ACPZ-1-R7 数据表(PDF) 23 Page - Analog Devices

部件名 ADP5587ACPZ-1-R7
功能描述  Mobile I/O Expander and QWERTY Keypad Controller
PDF  24 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADP5587ACPZ-1-R7 数据表(HTML) 23 Page - Analog Devices

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Data Sheet
ADP5587
Rev. E | Page 23 of 24
OUTLINE DIMENSIONS
0.30
0.25
0.20
0.80
0.75
0.70
0.20 MIN
2.20
2.10 SQ
2.00
0.50
BSC
0.50
0.40
0.30
COMPLIANT
TO JEDEC STANDARDS MO-220-WGGD-8
BOTTOM VIEW
TOP VIEW
SIDE VIEW
4.10
4.00 SQ
3.90
0.05 MAX
0.02 NOM
0.203 REF
COPLANARITY
0.08
1
24
7
12
13
18
19
6
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
EXPOSED
PAD
PIN 1
IN D ICATO R AR E A OP TIO N S
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
PIN 1
INDICATOR
AREA
SEATING
PLANE
Figure 21. 24-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-24-10)
Dimensions shown in millimeters
0.022
REF
A
B
C
D
E
0.645
0.600
0.555
SIDE VIEW
0.230
0.200
0.170
0.287
0.267
0.247
COPLANARITY
0.05
SEATING
PLANE
1
2
3
4
5
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
BALL A1
IDENTIFIER
0.40
BSC
1.60
REF
2.010
1.970 SQ
1.930
0.395
0.375
0.355
Figure 22. 25-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-25-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
I2C Write Address
Package Description
Package Option
Write
Read
ADP5587ACPZ-R7
−40°C to +85°C
0x68
0x69
24-Lead Lead Frame Chip Scale Package [LFCSP]
CP-24-10
ADP5587ACPZ-1-R7
−40°C to +85°C
0x60
0x61
24-Lead Lead Frame Chip Scale Package [LFCSP]
CP-24-10
ADP5587ACBZ-R7
−40°C to +85°C
0x68
0x69
25-Ball Wafer Level Chip Scale Package [WLCSP]
CB-25-4
ADP5587CP-EVALZ
0x68
0x69
Evaluation Board [LFCSP]
ADP5587CB-EVALZ
0x68
0x69
Evaluation Board [WLCSP]
1
Z = RoHS Compliant Part.



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