ADP5585

Data Sheet

Rev. C | Page 6 of 40

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

INT

RST/R5

1

A

B

C

D

23

4

C1

R2

VDD

C2

SDA

R4

C3

R1

SCL

C4

R0

GND

C0

R3

BALL A1

CORNER

TOP VIEW

(BALL SIDE DOWN)

Not to Scale

12

11

10

1

3

4

VDD

RST(R5)

C4

9

C3

R4

R2

2

R3

R1

TOP VIEW

Not to Scale

NOTES

1. THE EXPOSED PAD IS NOT CONNECTED.

IT IS RECOMMENDED TO CONNECT THE

EXPOSED PAD TO GROUND FOR THERMAL

DISSIPATION.

Figure 3. WLCSP Pin Configuration

Figure 4. LFCSP Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

WLCSP

LFCSP

Mnemonic

Description

D1

1

R4

GPIO 5 (GPIO Alternate Function: RESET1). This pin functions as Row 4 when used as a keypad.

D2

2

R3

GPIO 4 (GPIO Alternate Function: Logic Block Input LC, PWM_OUT). This pin functions as Row 3

when used as a keypad.

C1

3

R2

GPIO 3 (GPIO Alternate Function: Logic Block Input LB). This pin functions as Row 2 when used as a

keypad.

C2

4

R1

GPIO 2 (GPIO Alternate Function: Logic Block Input LA). This pin functions as Row 1 when used as a

keypad.

B1

5

R0

GPIO 1 (GPIO Alternate Function: Logic Block Output LY). This pin functions as Row 0 when used as a

keypad.

B4

6

C0

GPIO 7. This pin functions as Column 0 when used as a keypad.

C3

7

C1

GPIO 8. This pin functions as Column 1 when used as a keypad.

C4

8

C2

GPIO 9. This pin functions as Column 2 when used as a keypad.

D3

9

C3

GPIO 10 (GPIO Alternate Function: PWM_IN). This pin functions as Column 3 when used as a keypad.

D4

10

C4

GPIO 11 (GPIO Alternate Function: RESET2). This pin functions as Column 4 when used as a keypad.

B3

11

RST/R5

Input Reset Signal. To expand the keypad matrix, select the ADP5585ACBZ-01-R7 or the

ADP5585ACPZ-01-R7 device model for this pin to function as GPIO 6/Row 5.

A1

12

VDD

Supply Voltage Input.

A4

13

GND

Ground.

A2

14

SDA

A3

15

SCL

B2

16

INT

Open-Drain Interrupt Output.

EP

EP

Exposed Pad. The exposed pad is not connected. It is recommended to connect the exposed pad to

ground for thermal dissipation.