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Document Number: 61086

1

Revision: 19-Jan-10

LSUB

Vishay Electro-Films

Ceramic Submount for High Power LED

The LSUB series substrates are ceramic LED package

bases designed to provide thermal management for high

power (> 1 W) LED devices; the LSUB is designed to

minimize the thermal resistance between the die junction

and the package termination. The LSUB’s enhanced thermal

management enables a lower junction temperature and

increased efficiency and reliability compared to other

technologies. In addition to the increased brightness, the

lower junction temperature results in better color uniformity.

The LSUB is available in two configurations; in the standard

configuration the LED die is mounted directly over filled vias

and an offset version where the filled via is located to the side

of the die pad. The standard configuration is designed for the

attach methods including conductive epoxies and thick

solders (greater than 12 µm) while the offset configuration is

designed for thin eutectic solder layers in the 2 µm to 3 µm

range. An additional benefit of the standard configuration is

the pad size is large enough to accommodate a parallel

diode for ESD protection.

The LSUB is available singulated as individual die or in

square arrays. Additional LED configurations and form

factors available upon reques.

FEATURES

• Ultra-low thermal resistance

• Eutectic or epoxy LED die attach pads

• Surface-mounted component assembly

APPLICATIONS

• High power LED for automotive, industrial and home

applications

• High power laser diodes for industrial applications

Note

GENERAL SPECIFICATIONS

Substrate Material

Alumina 99.6 %, Alumina 96 % or AlN

Conductor Material

Copper

Conductor Thickness

5 µm ± 10 %

Substrate Thickness

25 mil (0.635 mm)

LED Die Size

40 mil x 40 mil (1 mm x 1 mm)

Operating Temperature (°C)

- 55 to + 125

Storage Temperature (°C)

- 55 to + 125

Die Bond Pad Metallization

Ni/Au or 80 %/20 % AuSn over Ni/Au

SUBSTRATE

STANDARD

OFFSET

AlN

35

Alumina (99.6 %)

68

Alumina (96 %)

10

12