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Document Number: 61086

3

Revision: 19-Jan-10

LSUB

Vishay Electro-Films

Ceramic Submount for High Power LED

LAYOUT CONSIDERATIONS

The thermal performance of the LSUB package is strongly influenced by PCB layout. The package ensures that heat flows from

the die junction to the package termination (anode); however, the heat must be carried from the termination by the PCB layout.

Special consideration must be given to insure minimal thermal resistance between the package termination and the ambient. The

following guidelines should be considered.

• The filled vias in the standard configuration can be up to 0.5 mils lower than the surrounding surface, when mounting dies on

top of these vias care should be taken to use an attachment method capable of overcoming this surface profile.

• The traces that carry current to and from the component also carry the heat away from the component. These traces should

be made as wide and thick as possible to help spread the heat on the PCB.

• The LED die should be kept as far as possible from other hot components such as DC circuitry, FETs and inductors.

• Heat sink elements are to be positioned as closely as possible to the LED package.

GLOBAL PART NUMBER INFORMATION

Global Part Number: LSUBNSPL

Global Part Number Description: LSUB, AlN, standard, plate

MODEL

Substrate

Surface

PACKAGING

CODE

LSUB

N = AlN

A = Alumina 99.6 %

T = Alumina 96 %

S = Standard

O = Offset

PL = Plate

SC = Scribed plate

ST = Diced on tape

WS = Waffle pack

SP

L

B

U

LS

N