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SFECF10M7DF00-R0 数据表(PDF) 60 Page - Murata Manufacturing Co., Ltd

部件名 SFECF10M7DF00-R0
功能描述  (Filters/Traps/Discriminators) for Audio/Visual Equipment
PDF  77 Pages
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制造商  MURATA1 [Murata Manufacturing Co., Ltd]
网页  http://www.murata.com
标志 MURATA1 - Murata Manufacturing Co., Ltd

SFECF10M7DF00-R0 数据表(HTML) 60 Page - Murata Manufacturing Co., Ltd

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Notice
Continued on the following page.
Filter is soldered twice within the following temperature
conditions.
1. Standard Reflow Soldering Conditions
(1) Reflow
Filter is soldered at +350±5°C for 3.0±0.5 seconds. The
soldering iron should not touch the filter while soldering.
(2) Soldering Iron
The component is recommended for use with placement
machines that employ optical placement capabilities.
Damage may result from excessive mechanical force.
Please make sure that you have evaluated by using
placement machines before going into mass production.
Do not use placement machines that utilize mechanical
positioning. Please contact Murata for details beforehand.
(3) Conditions for Placement Machines
(a) The component may be damaged if excess
mechanical stress is applied to it mounted on the
printed circuit board.
(b) Design layout of components on the PC board to
minimize the stress imposed on the warp or flexure of
the board.
(c) After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause
destruction resistance characteristics to degrade. To
prevent this, be extremely careful in determining
shape and dimension before designing the circuit
board diagram.
(d) When the positioning claws and pick-up nozzle are
worn, the load is applied to the components while
positioning is concentrated to one positioning
accuracy, etc. Careful checking and maintenance are
necessary to prevent unexpected trouble.
(e) When correcting chips with a soldering iron, the tip of
the soldering iron should not directly touch the chip
component.
(4) Other
o Soldering and Mounting
100
230
260
30 sec.
min.
40 sec.
max.
Peak
(260°C max.)
Pre-heating
(150-180°C)
Heating
(230°C)
Gradual
Cooling
120 sec.
min.
60-120 sec.
[Component Direction]
[Component Layout Close to Board]
Put the
component
lateral to the
direction in
which stress
acts.
Susceptibility to
stress is in the order
of : A>C>B
B
A
C
Slit
Perforation
Do not clean or wash the component as it is not
hermetically sealed.
2. Wash
c CERAFILr 4.5-6.5MHz Chip Type SFSKA Series
58
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.



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