SFECF10M7DF00-R0 datasheet(67/77 Pages) MURATA1

67 / 77 page

Notice

Continued on the following page.

Filter is soldered twice within the following temperature

conditions.

1. Standard Reflow Soldering Conditions

(1) Reflow

Filter is soldered at +350±5°C for 3.0±0.5 seconds. The

soldering iron should not touch the filter while soldering.

(2) Soldering Iron

The component is recommended for use with placement

machines that employ optical placement capabilities.

Damage may result from excessive mechanical force.

Please make sure that you have evaluated by using

placement machines before going into mass production.

Do not use placement machines that utilize mechanical

positioning. Please contact Murata for details beforehand.

(3) Conditions for Placement Machines

(a) The component may be damaged if excess

mechanical stress is applied to it mounted on the

printed circuit board.

(b) Design layout of components on the PC board to

minimize the stress imposed on the warp or flexure of

the board.

the circuit board, mechanical stress will cause

destruction resistance characteristics to degrade. To

prevent this, be extremely careful in determining

shape and dimension before designing the circuit

board diagram.

(d) When the positioning claws and pick-up nozzle are

worn, the load is applied to the components while

positioning is concentrated to one positioning

accuracy, etc. Careful checking and maintenance are

necessary to prevent unexpected trouble.

(e) When correcting chips with a soldering iron, the tip of

the soldering iron should not directly touch the chip

component.

(4) Other

o Soldering and Mounting

100

230

260

30 sec.

min.

40 sec.

max.

Peak

(260°C max.)

Pre-heating

(150-180°C)

Heating

(230°C)

Gradual

Cooling

120 sec.

min.

60-120 sec.

[Component Direction]

[Component Layout Close to Board]

Put the

component

lateral to the

direction in

which stress

acts.

Susceptibility to

stress is in the order

of : A>C>B

Slit

Perforation

Do not clean or wash the component as it is not

hermetically sealed.

2. Wash

c Ceramic Trap 4.5-6.5MHz Chip Type TPSKA Series

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical speciﬁcations. Therefore, please approve our product speciﬁcations or transact the approval sheet for product speciﬁcations before ordering.

SFECF10M7DF00-R0 数据表(PDF) 67 Page - Murata Manufacturing Co., Ltd

SFECF10M7DF00-R0 数据表(HTML) 67 Page - Murata Manufacturing Co., Ltd

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