Table of Contents

Overview........................................................................................................................................................ 1

Microprocessor Subsystem Features......................................................................................................1

FPGA Features....................................................................................................................................... 2

1.

Block Diagram.........................................................................................................................................7

2.

Product Family Table...............................................................................................................................8

3.

Microprocessor Subsystem...................................................................................................................10

3.1.

CPUs.......................................................................................................................................... 10

3.2.

Debug.........................................................................................................................................14

3.3.

Interrupts.................................................................................................................................... 15

3.4.

Memory Subsystems..................................................................................................................16

3.5.

Processor I/O............................................................................................................................. 18

3.6.

Processor-to-Fabric Interconnect............................................................................................... 23

3.7.

Secure Boot................................................................................................................................24

3.8.

Peripheral Memory SECDED Reporting and Error Injection...................................................... 24

3.9.

DMA Controller...........................................................................................................................24

4.

Programmable Logic Subsystem.......................................................................................................... 25

4.1.

Clock Management.................................................................................................................... 25

4.2.

Debug Probe System................................................................................................................. 26

4.3.

I/Os.............................................................................................................................................26

4.4.

Non-Volatile FPGA Fabric.......................................................................................................... 33

4.5.

PCI Express............................................................................................................................... 36

5.

System Controller .................................................................................................................................38

5.1.

System Services.........................................................................................................................38

5.2.

Programming..............................................................................................................................38

6.

Low Power............................................................................................................................................ 40

6.1.

Non-Volatile Technology.............................................................................................................40

6.2.

Lower Power "L" Devices........................................................................................................... 40

6.3.

Low-Power Transceiver Lane.....................................................................................................40

7.

Reliability...............................................................................................................................................41

7.1.

FPGA Fabric...............................................................................................................................41

7.2.

LSRAM....................................................................................................................................... 41

7.3.

µSRAM.......................................................................................................................................41

7.4.

Digests....................................................................................................................................... 41

7.5.

System Controller Suspend Mode..............................................................................................41

8.

Security................................................................................................................................................. 43

8.1.

Design Security.......................................................................................................................... 43

9.

PolarFire SoC Device Offerings............................................................................................................ 44

10. Ordering Information............................................................................................................................. 45

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and its subsidiaries

Overview

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