Pad Coordinates

Unit:

mm

Pad No.

X

Y

Pad No.

X

Y

1

-876.150

1043.000

14

916.350

514.500

2

-876.150

931.200

15

916.350

625.100

3

-876.150

817.560

16

916.350

725.100

4

-876.150

715.600

17

916.350

835.700

5

-916.350

-63.124

18

916.350

935.700

6

-916.350

-740.976

19

916.350

1046.300

7

-916.350

-842.650

20

704.250

1041.550

8

-916.350

-942.650

21

593.650

1041.550

9

-916.350

-1044.324

22

493.650

1041.550

10

710.500

-1041.350

23

383.050

1041.550

11

810.500

-1041.350

24

283.050

1041.550

12

921.100

-1041.350

25

172.450

1041.550

13

916.350

414.500

Pad Description

Pad No.

Pad Name

I/O

Internal

Connection

Function

8, 7

VDD, VSS

¾¾

Digital power supply, ground

3,4

VDDA, VSSA

¾¾

DAC power supply

10~17

PA0~PA7

I/O

Wake-up,

Pull-high or

None

Bidirectional 8-bit I/O port, wake-up by mask option

25~18

PB0~PB7

I/O

Pull-high or

None

Bidirectional 8-bit I/O port

9

RESET

I

¾

Reset input, active low

6

OSC1

I

X

¢tal/Resistor XIN for X¢tal or ROSCIN for resistor by mask option

5

OSC2

O

¾

XOUT or T1

1

AUD

O

¾

DAC output interface

Absolute Maximum Ratings

Storage Temperature ...........................

-50°Cto125°C

Operating Temperature ..........................

-25°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those

listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-

ity.

HT36F2

Rev. 1.00

3

August 15, 2005