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STGAP2DMTR 数据表(PDF) 6 Page - STMicroelectronics

部件名 STGAP2DMTR
功能描述  Galvanically isolated 4 A half-bridge gate driver
PDF  22 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STGAP2DMTR 数据表(HTML) 6 Page - STMicroelectronics

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Symbol
Pin
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Driver buffer section
IGON
GOUT
Source short-circuit current
TJ = 25 °C
-
4
-
A
TJ = -40 to +125 °C (2)
3
-
5
IGOFF
GOUT
Sink short-circuit current
TJ = 25 °C
-
4
-
A
TJ = -40 to +125 °C (2)
3
-
5.5
VGONH
GOUT
GON output high-level voltage
IGON = 100 mA
VH - 0.15
VH - 0.125
-
V
VGOFFL
GOUT
GOFF output low-level voltage
IGOFF = 100 mA
-
110
120
mV
RGON
GOUT
Source RDS_ON
IGON = 100 mA
-
1.25
1.5
Ω
RGOFF
GOUT
Sink RDS_ON
IGOFF = 100 mA
-
1.1
1.2
Ω
Overtemperature protection
TSD
Shutdown temperature
-
170
-
-
°C
Thys
Temperature hysteresis
-
-
20
-
°C
Standby
tSTBY
-
Standby time
See Section 5.6
200
280
500
µs
tWUP
-
Wake-up time
10
20
35
µs
tawake
-
Wake-up delay
90
140
200
µs
tstbyfilt
-
Standby filter
200
280
800
ns
1. PWD = max (|tDon(A) - tDon(B)|, |tDoff(A) - tDoff(B)|, |tDoff(A) - tDon(B)|, |tDoff(B) - tDon(A)|).
2. Characterization data, not tested in production.
Table 6. Isolation related specifications
Parameter
Symbol
Value
Unit
Conditions
Clearance
(Minimum External Air Gap )
CLR
4
mm
Measured from input terminals to output terminals,
shortest distance through air
Creepage (*)
(Minimum External Tracking)
CPG
4
mm
Measured from input terminals to output terminals,
shortest distance path along body
Comparative Tracking Index
(Tracking Resistance)
CTI
≥ 400
V
DIN IEC 112/VDE 0303 Part 1
Isolation Group
II
Material Group (DIN VDE 0110, 1/89, Table 1)
STGAP2D
Electrical characteristics
DS12746 - Rev 3
page 6/22



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