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STTH60200CHR 数据表(PDF) 6 Page - STMicroelectronics

部件名 STTH60200CHR
功能描述  Rad-Hard 60 A - 200 V fast recovery rectifier
PDF  12 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STTH60200CHR 数据表(HTML) 6 Page - STMicroelectronics

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2
Radiation
The technology of the STMicroelectronics Rad-Hard rectifier’s diodes is intrinsically highly resistant to radiative
environments.
The product radiation hardness assurance is supported by a total ionisation dose (TID) test at high dose rate and
a single effect event (SEE) characterization.
2.1
Total dose radiation (TID) testing
The part has been characterized in total ionizing dose at high dose rate on 12 parts packaged in SMD1, 4 parts
unbiased, 4 parts reverse biased and 4 parts forward biased. All parts were from the same wafer lot.
The irradiation has been done according to the ESCC 22900 specification, standard window.
Both pre-irradiation and post-irradiation performances have been tested using the same circuitry and test
conditions for a direct comparison can be done (Tamb = 22 ±3 °C unless otherwise specified).
The following parameters were measured :
Before irradiation
After irradiation at final dose 3 Mrad(Si)
After 168 hrs at room temperature
after 168 hrs at 100 °C anneal
Based on this characterization, the device is deemed able to sustain 3 Mrad(Si) while maintaining all its
parameters within its specifications.
2.2
Single event effect
The Single Event Effect (SEE) relevant to power rectifiers are characterized, i.e. the Single Event Burnout (SEB).
The tests are performed as per ESCC 25100, each one on 3 pieces from 1 wafer at room temperature.
The accept/reject criteria are :
SEB (Destructive mode):
The diode is reverse biased during irradiation. The test is stopped as soon as a SEB occurs or when the
reverse leakage current is above the specification or when the overall fluency on the component reaches
1E7 cm².
Post irradiation stress test (PIST):
After the irradiation, a stress is applied to the diode in order to reveal any latent damage on the irradiated
devices.
The reverse voltage value is increased from 0 V to 100% of VRmax. and then decreased from 100% of the
VRmax. to 0 V. At each step, the reverse leakage current value is measured.
Table 5. Radiation hardness assurance summary
Type
Conditions
Result
Total ionisation dose
Characterization of 1 wafer up to 3 Mrad(Si)
Test of 4 reverse biased + 4 forward biased + 4 unbiased samples
Test at High Dose Rate
Immune up to 3 Mrad(Si)
Single effect burnout
LET : 61.2 MeV.cm/mg
Vcc : 200 V
No burnout
STTH60200CHR
Radiation
DS12587 - Rev 2
page 6/12



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