ACEPACK™ 1

Features

•

ACEPACK™ 1 power module

–

DBC Cu Al2O3 Cu

•

Sixpack topology

–

650 V, 50 A IGBTs and diodes

–

Soft and fast recovery diode

•

Integrated NTC

Applications

•

Inverters

•

Industrial

•

Motor drives

Description

This power module is a sixpack topology in an ACEPACK™ 1 package with NTC,

integrating the advanced trench gate field-stop technologies from

STMicroelectronics. This new IGBT technology represents the best compromise

between conduction and switching loss, to maximize the efficiency of any converter

system up to 20 kHz.

Product status

A1P50S65M2

Product summary

Order code

A1P50S65M2

Marking

A1P50S65M2

Package

ACEPACK™ 1

Leads type

Solder contact pins

ACEPACK™ 1 sixpack topology, 650 V, 50 A,

trench gate field

‑stop M series IGBT with soft diode and NTC

A1P50S65M2

Datasheet

DS12332 - Rev 3 - November 2018

For further information contact your local STMicroelectronics sales office.

www.st.com