STPS20LCD200C datasheet(3/10 Pages) STMICROELECTRONICS

3 / 10 page

STPS20LCD200C

Characteristics

DocID024741 Rev 4

3/10

1.1

Characteristics (curves)

Figure 1: Average forward power dissipation

versus average forward current (per diode)

Figure 2: Relative variation of thermal impedance

junction to case versus pulse duration

Figure 3: Reverse leakage current versus reverse

voltage applied (typical values, per diode)

Figure 4: Junction capacitance versus reverse

voltage applied (typical values, per diode)

Figure 5: Forward voltage drop versus forward

current (per diode)

Figure 6: Thermal resistance junction to ambient

versus copper surface under tab for DPAK

(typical values)

PF(AV)(W)

= 0.05

= tp/T

= 0.2

= 0.5

= 1

= 0.1

IF(AV)(A)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

th (j -c)/Rth (j -c)

Single pulse

DPAK / TO-220AB

t (s)

1.E-05

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

100

120

140

160

180

200

IR(mA)

j=150°C

j=125°C

j=25°C

j=100°C

j=50°C

j=75°C

VR(V)

100

1000

100

1000

C(pF)

F = 1 MHz

OSC = 30 mVRMS

j = 25 °C

VR(V)

SCu(cm²)

Rth(j-a) (°C/W)

DPAK

Epoxy printed board FR4, eCu= 35 µm

100

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