Symbol

mm

Min.

Typ.

Max.

L1

1.00

k

0

8

aaa

0.10

Note:

HTSSOP stands for thermally enhanced variations. Dimension “D” does not include mold flash, protrusions or

gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per side. Dimension “E1” does not

include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per side. The

size of exposed pad is variable depending of lead frame design pad size. End user should verify “D1” and “E2”

dimensions for each device application.

Figure 36. HTSSOP16 recommended footprint

ALED6000

HTSSOP16 package information

DS13018 - Rev 4

page 39/45