2

Electrical specifications

2.1

Absolute maximum ratings

Stressing the device above the rating listed in the Table 3: absolute maximum ratings may cause permanent

damage to the device. These are stress ratings only and operation of the device at these or any other conditions

above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

program and other relevant quality documents.

Table 3. Absolute maximum ratings

Symbol

Parameter

Value

Unit

Vs

DC supply voltage

-0.3 to 40

V

Is

Input current

internally limited

-

Vo

DC output voltage

-0.3 to 6

V

Io

DC output current

internally limited

-

VEn

Enable input

-0.3 to 40

-

TJ

Junction operating temperature

-40 to 150

°C

VESD HBM

ESD HBM voltage level (HBM-MIL STD 883C)

±2

kV

VESD CDM

ESD CDM voltage level (CDM)

±750 (1)

V

1. ±500 V for En1 and En2 (only for L5050SD).

Table 4. Thermal data

Item

Symbol

Parameter

Value (1)

Unit

L5050S

L5050SD

A.022

RthJL

Thermal resistance, junction-to-lead

60.6

60.6

°C/W

A.001

RthJA

Thermal resistance, junction-to-ambient

96

94

°C/W

1. PCB: single layer; FR4 area = 77 mm x 86 mm; PCB thickness = 1.6 mm; Cu thickness = 70 µm (front side), Cu area = 2

cm^2.

L5050

Electrical specifications

DS13704 - Rev 3

page 5/25