Symbol

Dimensions in mm

Min.

Typ.

Max.

Ө2

10°

12°

14°

Ө3

10°

12°

14°

A

-

-

1.20

A1

0.05

-

0.15

A2

0.95

1.00

1.05

b

0.17

0.22

0.27

b1

0.17

0.20

0.23

c

0.09

-

0.20

c1

0.09

-

0.16

D

12.00 BSC

D1

10.00 BSC

D2(1)

-

-

6.40

D3(2)

4.80

-

-

e

0.50 BSC

E

12.00 BSC

E1

10.00 BSC

E2(1)

-

-

6.40

E3(2)

4.80

-

-

L

0.45

0.60

0.75

L1

1.00 REF

N

64

R1

0.08

-

-

R2

0.08

-

0.20

S

0.20

-

-

Tolerance of form and position

aaa

0.20

bbb

0.20

ccc

0.08

ddd

0.08

1. Dimensions D2 and E2 show the maximum exposed metal area on the package surface where the exposed pad is

located (if present). It includes all metal protrusions from exposed pad itself. End user should verify D2 and E2 dimensions

according to specific device application.

2. Dimensions D3 and E3 show the minimum solderable area, defined as the portion of exposed pad which is guaranteed to

be free from resin flashes/bleeds, bordered by internal edge of inner groove.

L9689E

TQFP64 (10X10X1.0 mm, 6.0x6.0 mm exp. pad down) package information

DB4807 - Rev 2

page 13/19