Contents

1

Block diagram and pin description .................................................2

1.1

Block diagram ................................................................. 2

1.2

Pin description ................................................................. 3

2

Maximum ratings ..................................................................6

2.1

Absolute maximum ratings....................................................... 6

2.2

Temperature ranges and thermal data ............................................. 8

3

Device overview ...................................................................9

3.1

Main features .................................................................. 9

3.2

SPI interface .................................................................. 9

3.3

Deployment drivers and diagnostics ............................................... 9

3.4

Remote sensor interfaces ....................................................... 9

3.5

DC sensor interfaces ........................................................... 9

3.6

General purpose low-side outputs ............................................... 10

3.7

A/D converters................................................................ 10

4

Applicative circuit ................................................................11

5

Package information..............................................................12

5.1

TQFP64 (10X10X1.0 mm, 6.0x6.0 mm exp. pad down) package information............ 12

Revision history .......................................................................15

L9689E

Contents

DB4807 - Rev 2

page 16/19