Contents

1

Block diagram and pin description .................................................3

1.1

Block diagram ................................................................. 3

1.2

Pin description ................................................................. 4

2

Maximum ratings ..................................................................8

2.1

Absolute maximum ratings....................................................... 8

2.2

Temperature ranges and thermal data ............................................ 12

3

Device overview ..................................................................13

3.1

Main features ................................................................. 13

3.2

SPI interface ................................................................. 13

3.3

Power supply and energy reserve management .................................... 13

3.4

Safing FET regulator and diagnostics............................................. 13

3.5

Deployment drivers and diagnostics .............................................. 14

3.6

Remote sensor interfaces ...................................................... 14

3.7

DC sensor interfaces .......................................................... 14

3.8

General purpose low-side outputs ............................................... 14

3.9

Arming/Passenger inhibit logic .................................................. 15

3.10

LIN interface and decoder ...................................................... 15

3.11

A/D converters................................................................ 15

4

Applicative circuit ................................................................16

5

Package information..............................................................17

5.1

TQFP128 (14X14X1.0 mm, 8.0x8.0 mm exp. pad down) package information .......... 17

Revision history .......................................................................20

L9690

Contents

DB4806 - Rev 2

page 21/24