J

A

D

JA

T

T

P

R

T

u

(3)

where

• PD is the device power dissipation

• TJ is the device junction temperature

• TA is the ambient temperature

• RθJA is the package (junction-to-air) thermal resistance

Because of this relationship, acceptable load current in high temperature conditions may be less than the

maximum current-sourcing capability of the device. In no case should the device be operated outside of its

maximum power rating because doing so can result in premature failure or permanent damage to the device.

REF70

SNAS781E – OCTOBER 2020 – REVISED JULY 2022

www.ti.com

22

Submit Document Feedback

Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: REF70