LP-MSM110SLASH33 datasheet(2/5 Pages) LEIDITECH

2 / 5 page

Test

Test Conditions

Accept/Reject Criteria

Resistance

In still air @ 25℃

Rmin≤R≤Rmax

Time to Trip

Specified current，Vmax，25℃

≤maximum Time to Trip

Hold Current

30min，at IH

No trip

Trip Cycle Life

Vmax，Imax，100cycles

No arcing or burning

Trip Endurance

Vmax，1 hours

No arcing or burning

Physical Characteristics and Environmental Specifications

Physical Characteristics

Terminal materials :

Tin-Plated Nickle-copper

Soldering

zone

Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.

Environmental Specifications

Test

Conditions

Resistance Change

Passive aging

85℃,1000hours

±10%

Humidity aging

85℃/85%RH.1000 hours

±5%

Thermal shock

MIL-STD-202,Method 107G

+85℃/-40℃,20times

-30% typical resistance change

Solvent Resistance

MIL-STD-202,Method 215

no change

Vibration

ML-STD-883C,Test Condition A

No chage

Electrical Specifications:

Ihold = Hold Current. Maximum current device will not trip in 25°C still air.

Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air.

Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).

Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax).

Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.

R1max = Maximum device resistance is measured one hour post reflow.

Test Procedures And Requirements

Rev :

www.leiditech.com

01.06.2018

2/5

LP-MSM110/33

LP-MSM110/33 数据表(PDF) 2 Page - Shanghai Leiditech Electronic Technology Co., Ltd

LP-MSM110/33 数据表(HTML) 2 Page - Shanghai Leiditech Electronic Technology Co., Ltd

Html Pages

1 2 3 4 5

数据表下载