The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38℃ could result in the

deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with

high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the

components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be

opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present

Warning

• Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and

flame.

• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be

used when repeated fault conditions or prolonged trip events are anticipated.

• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended

electronic, thermal, and mechanical procedures for electronic components.

• Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.

• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.

• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the

performance of the devices.PPTC SMD can be cleaned by standard methods.

• Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper

board layouts or reflow profilecould negatively impact solderability performance of our devices.

Storage

Shanghai Leiditech Electronic Co.,Ltd

Email: sale1@leiditech.com

Tel : +86- 021 50828806

Fax : +86- 021 50477059

Rev :

www.leiditech.com

01.06.2018

5/5

LP-MSM110/33