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STL8N65M2 数据表(PDF) 2 Page - STMicroelectronics |
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STL8N65M2 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 15 page ![]() 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ±25 V ID Drain current (continuous) at TC = 25 °C 4 A Drain current (continuous) at TC = 100 °C 2.6 A IDM Drain current pulsed 16 A PTOT Total power dissipation at TC = 25 °C 48 W IAR Avalanche current, repetitive or non-repetitive (pulse width limited by Tj max) 0.9 A EAS Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V) 95 mJ dv/dt (2) Peak diode recovery voltage slope 15 V/ns dv/dt (3) MOSFET dv/dt ruggedness 50 Tj Operating junction temperature range -55 to 150 °C Tstg Storage temperature range 1. Pulse width is limited by safe operating area. 2. ISD ≤ 4 A, di/dt ≤ 400 A/μs; VDS(peak) < V(BR)DSS, VDD = 400 V 3. VDS ≤ 480 V Table 2. Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case 2.6 °C/W Rthj-pcb (1) Thermal resistance junction-pcb 59 °C/W 1. When mounted on 1 inch² FR-4, 2 Oz copper board Table 3. Thermal data Symbol Parameter Value Unit IAR Avalanche current, repetetive or not repetetive (pulse width limited by Tjmax) 0.5 °C/W EAS Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR; VDD = 50 V) 88 °C/W STL8N65M2 Electrical ratings DS13016 - Rev 1 page 2/15 |
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