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STF26N65DM2 数据表(PDF) 2 Page - STMicroelectronics |
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STF26N65DM2 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 13 page ![]() 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ±25 V ID(1) Drain current (continuous) at Tcase = 25 °C 20 A Drain current (continuous) at Tcase = 100 °C 12.6 IDM(2) Drain current (pulsed) 53 A PTOT Total dissipation at Tcase = 25 °C 30 W dv/dt(3) Peak diode recovery voltage slope 50 V/ns dv/dt(4) MOSFET dv/dt ruggedness 50 VISO Insulation withstand voltage (RMS) from all three leads to external heatsink (t = 1 s, TC = 25 °C) 2500 V Tstg Storage temperature range -55 to 150 °C Tj Operating junction temperature range 1. Limited by maximum junction temperature 2. Pulse width is limited by safe operating area. 3. ISD ≤ 20 A, di/dt=900 A/μs, VDS peak < V(BR)DSS, VDD = 400 V 4. VDS ≤ 520 V Table 2. Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case 4.2 °C/W Rthj-amb Thermal resistance junction-ambient 62.5 Table 3. Avalanche characteristics Symbol Parameter Value Unit IAR(1) Avalanche current, repetitive or not repetitive 3 A EAS(2) Single pulse avalanche energy 530 mJ 1. Pulse width is limited by TJmax. 2. Starting Tj = 25 °C, ID = IAR, VDD = 50 V STF26N65DM2 Electrical ratings DS12426 - Rev 2 page 2/13 |
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