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©Copyright 2006. STATS ChipPAC Ltd. All rights reserved.

May 2006

Corporate Office

10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823

Global Offices

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CHINA 86-21-5976-5858

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NETHERLANDS 31-38-333-2023

FBGA

Fine Pitch Ball Grid Array

SPECIFICATIONS

Die Thickness

75–300µm (3-12 mils)

Mold Cap Thickness

0.25-0.90mm

Marking

Laser

Packing Options

Tape & reel/JEDEC tray

RELIABILITY

Moisture Sensitivity Level

JEDEC Level 2A, 260°C Reflow

Temperature Cycling

Condition C (–65°C to 150°C),

1000 cycles

High Temp Storage

150°C, 1000 hrs

Pressure Cooker Test

121°C/100% RH/2atm, 168 hrs

Temperature/Humidity Test

85°C/85% RH, 1000 hrs

Unbiased HAST

130°C/85% RH/2 atm, 96 hrs

THERMAL PERFORMANCE,

θθθθθja (°C/W)

Thermal performance is highly dependent on package size, die size, substrate layers and thickness, and solder ball configuration.

Simulation for specific applications should be performed to obtain maximum accuracy.

Package

Body Size (mm)

Pin Count

Die Size (mm)

Thermal Performance

θja(ºC/W)

LFBGA

11 x 11 (2L)

144

4.5 x 4.5

34.1

15 x 15 (4L)

208

10.2 x 10.2

19.4

Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-9) under natural convection as defined in JESD51-2.

ELECTRICAL PERFORMANCE

Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design

to provide the best prediction of electrical behavior. First order approximations can be calculated using parasitics per unit length for the

constituents of the signal path. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire.

Conductor

Length

Resistance

Inductance

Inductance

Capacitance

Capacitance

Component

(mm)

(mOhms)

(nH)

Mutual (nH)

(pF)

Mutual (pF)

Wire

2

120

1.65

0.45 - 0.85

0.10

0.01 - 0.02

Net (2L)

2 - 7

34 -119

1.30 - 4.55

0.26 - 2.28

0.25 - 0.95

0.06 - 0.42

Total (2L)

4 - 9

154 - 239

2.95 - 6.20

0.71 - 3.13

0.35 - 1.05

0.07 - 0.44

Wire

2

120

1.65

0.45 - 0.85

0.10

0.01 - 0.02

Net (4L)

2 - 7

34 - 119

0.90 - 3.15

0.18 - 1.58

0.35 - 1.10

0.06 - 0.42

Total (4L)

4 - 9

154 - 239

2.55 - 4.80

0.63 - 2.43

0.45 - 1.20

0.07 - 0.44

Note: Net = Total Trace Length + Via + Solder Ball.

CROSS-SECTION

FBGA

PACKAGE CONFIGURATIONS

Body Sizes (mm)

4x4 to 23x23; Common body sizes: 5x10,

7x9, 8x10, 8x11, 8x12, 8x14, 10x12, 10x14,

13x13, 15x15, 16x16, 17x17

Ball Count

40 to 450

Ball Pitch (mm)

0.50 to 0.80

Typ. Pkg. Thickness LFBGA:

1.70mm (1.40mm max. typical)

TFBGA:

1.20mm max.

VFBGA:

1.00mm max.

WFBGA:

0.80mm max.

UFBGA:

0.55mm max.

LFBGA-H