www.statschippac.com

FEATURES

• Thin, lightweight, space saving package

• Flexible body sizes range from 4mm x 4mm to

23mm x 23mm

• 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch

• Eutectic & Pb free solder balls

• Green package available

• Multiple routing layers and dedicated ground/power

planes available for improved electrical performance

• BT laminate materials (2 and 4 metal layers)

• JEDEC standard compliant

APPLICATIONS

• Microprocessors/Controllers

• Wireless RF

• Analog

• ASIC

• Memory

• Simple PLDs

• Others

• Array molded, cost effective, space

saving package solution

• Available in 1.40mm (LFBGA),

1.20mm (TFBGA), and 1.00mm

(VFBGA), 0.80mm (WFBGA) and

0.55mm (UFBGA) maximum

thickness

• Laminate substrate based package

which enables 2 and 4 layers of

routing flexibility

DESCRIPTION

STATS ChipPAC’s Fine Pitch Ball Grid Array (FBGA) is a

laminate substrate based chip scale package with plastic

overmolded encapsulation and an array of fine pitch solder

ball terminals. The FBGA package’s reduced outline and

thickness and higher density options make it an ideal

advanced technology packaging solution for high perform-

ance and/or portable applications. The use of the latest

materials and advanced assembly infrastructure produce a

reliable and cost effective package. Lead free and halogen

free compatible material sets are available. STATS ChipPAC’s

FBGA is available in a broad range of JEDEC standard body

sizes with LFBGA (<1.70mm [typically <1.40mm]), TFBGA

(<1.20mm), VFBGA (<1.00mm), WFBGA (<0.80mm) and

UFBGA (0.55mm max.) thickness. LFBGA-H (with attached

heatsink) is qualified for small body sizes.

FBGA

Fine Pitch Ball Grid Array