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MQFP 数据表(PDF) 2 Page - STATS ChipPAC, Ltd.

部件名 MQFP
功能描述  Metric Quad Flat Pack
PDF  2 Pages
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制造商  STATSCHIP [STATS ChipPAC, Ltd.]
网页  http://www.statschippac.com
标志 STATSCHIP - STATS ChipPAC, Ltd.

MQFP 数据表(HTML) 2 Page - STATS ChipPAC, Ltd.

  MQFP Datasheet HTML 1Page - STATS ChipPAC, Ltd. MQFP Datasheet HTML 2Page - STATS ChipPAC, Ltd.  
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The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks
of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information
will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.
STATS ChipPAC reserves the right to change the information at any time and without notice.
©Copyright 2005. STATS ChipPAC Ltd. All rights reserved.
January 2005
Corporate Office
10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
Global Offices
USA 510-979-8000
JAPAN 81-43-351-3320
CHINA 86-21-5976-5858
MALAYSIA 603-4257-6222
KOREA 82-31-639-8911
TAIWAN 886-3-593-6565
UK 44-1483-413-700
NETHERLANDS 31-38-333-2023
MQFP
Metric Quad Flat Pack
SPECIFICATIONS
Die Thickness
380-560
µm (15-22mils) range preferred
Gold Wire
25/30
µm (1.0/1.2mils) diameter, 99.999%Au
Lead Finish
85/15 Sn/PB or Matte Tin
Marking
Laser / ink
Packing Options
JEDEC tray / tape and reel
RELIABILITY
Moisture Sensitivity Level
JEDEC Level 3
Temperature Cycling
-65°C/150°C, 1000 cycles
High Temperature Storage
150°C, 500 hrs
Pressure Cooker Test
121°C, 100% RH,
2 atm, 168 hrs
Liquid Thermal Shock (opt)
-55°C/125°C, 1000 cycles
PACKAGE CONFIGURATIONS
Package Size (mm)
Lead Count
10 x 10
44, 52
14 x 14
64, 80, 100
14 x 20
64, 80, 100, 128
28 x 28
120, 128, 144, 160, 208
32 x 32*
240
Note: *Cavity down configuration available.
THERMAL PERFORMANCE,
θθθθθja (°C/W)
Package
Body Size (mm)
Pad Size (mm)
Die Size (mm)
Thermal Performance,
θθθθθja (°C/W)
100L
14 x 14 x 2.0
9.0 x 9.0
7.8 x 7.8
37.0
208L
28 x 28 x 3.4
14.0 x 14.0
10.2 x 10.2
24.8
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2.
CROSS-SECTION
ELECTRICAL PERFORMANCE
Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design
to provide the best prediction of electrical behavior. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire.
Conductor
Length
Resistance
Inductance
Inductance
Capacitance
Capacitance
Component
(mm)
(mOhms)
(nH)
Mutual (nH)
(pF)
Mutual (pF)
Wire
2
120
1.65
0.45 - 0.85
0.10
0.01 - 0.02
Lead (10 x 10mm, 44L)
2.4 - 3.2
19.0 - 25.0
1.56 - 1.75
0.70 - 0.79
0.31 - 0.38
0.14 - 0.17
Total (10 x 10mm, 44L)
139 - 145
3.21 - 3.4
1.15 - 1.64
0.41 - 0.48
0.15 - 0.19
Wire
2
120
1.65
0.45 - 0.85
0.10
0.01 - 0.02
Lead (32 x 32mm, 240L)
11.0 - 12.6
88.0 - 100.8
6.05 - 7.25
3.33 - 3.99
1.64 - 1.89
0.66 - 0.76
Total (32 x 32mm, 240L)
208 - 220.8
7.7 - 8.9
3.78 - 4.84
1.74 - 1.99
0.67 - 0.78



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