www.statschippac.com

FEATURES

• Body Sizes: 10 x 10mm to 32 x 32mm

• Package Height: 2.0 mm to 3.4mm

• Lead Counts: 44L to 240L

• Lead Pitch: 0.80mm to 0.50mm

• Wide range of open tool leadframe and die pad

sizes available

• Moisture Sensitivity: JEDEC Level 3

• JEDEC standard compliant

• Lead-free and Green material sets available

• Copper and alloy leadframes available

APPLICATIONS

• ASIC

• DSP

• Gate Array

• Logic / Microprocessors / Controllers

• Multimedia, PC Chipsets, Others

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• 10 x 10mm to 32 x 32mm body

sizes

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• 44 to 240 lead counts

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• Lead pitch range from 0.80mm

to 0.50mm

DESCRIPTION

STATS ChipPAC’s Metric Quad Flat Pack (MQFP) is a

leadframe based, plastic encapsulated package with gull

wing shaped leads on four sides. The MQFP is targeted at

cost sensitive applications while providing a high degree

of thermal and electrical performance. Offered in a wide

range of body sizes and pin counts, the MQFP provides

designers with the flexibility and convenience of meeting

their packaging needs for a large variety of device designs.

MQFP

Metric Quad Flat Pack