SPC574S60 datasheet(20/77 Pages) STMICROELECTRONICS

20 / 77 page

Electrical characteristics

SPC574Sx

20/77

DS10601 Rev 6

3.4

Electromagnetic compatibility (EMC)

Information about EMC performance is available from STMicroelectronics on request.

3.5

Electrostatic discharge (ESD)

Table 7 describes the ESD ratings of the device.

3.6

Operating conditions

1. Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings

only, and functional operation at the maxima is not guaranteed. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability or cause permanent damage to the device. During overload conditions (VIN >

VDD_HV_IO or VIN < VSS), the voltage on pins with respect to ground (VSS) must not exceed the recommended values.

2. External regulator mode.

3. Allowed 5.5–6.0 V for 60 seconds cumulative time with no restrictions, for 10 hours cumulative time device in reset, TJ =°C

remaining time at or below 5.5 V.

4. The maximum input voltage on an I/O pin tracks with the associated I/O supply maximum. For the injection current

condition on a pin, the voltage will be equal to the supply plus the voltage drop across the internal ESD diode from I/O pin

to supply. The diode voltage varies greatly across process and temperature, but a value of 0.3V can be used for nominal

calculations.

5. Analog and digital controller pins must not exceed mA. A VDD_HV_IO power segment is defined as one or more GPIO pins

located between two VDD_HV_IO supply pins.

6. Solder profile per IPC/JEDEC J-STD-020D.

7. Moisture sensitivity per JEDEC test method A112.

Table 7. ESD ratings(1),(2)

Parameter

Conditions

Value

Unit

ESD for Human Body Model (HBM)(3)

All pins

2000

ESD for field induced Charged Device Model (CDM)(4)

All pins

500

1. All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits.

2. Device failure is defined as: “If after exposure to ESD pulses, the device does not meet the device specification

requirements, which includes the complete DC parametric and functional testing at room temperature and hot temperature.

Maximum DC parametrics variation within 10% of maximum specification”.

3. This parameter tested in conformity with ANSI/ESD STM5.1-2007 Electrostatic Discharge Sensitivity Testing.

4. This parameter tested in conformity with ANSI/ESD STM5.3-1990 Charged Device Model - Component Level.

Table 8. Device operating conditions(1)

Symbol

Parameter

Conditions

Value

Unit

Min

Typ

Max

Frequency

fSYS

Device

operating

frequency(2)

TJ -40 °C to 150 °C

—

140

MHz

Temperature

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