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STR485 数据表(PDF) 18 Page - STMicroelectronics |
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STR485 数据表(HTML) 18 Page - STMicroelectronics |
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18 / 24 page ![]() 8.1 DFN10 package information Figure 21. DFN10 package outline Table 11. DFN10 package mechanical data Symbol mm Min. Typ. Max. A 0.80 0.90 1.00 A1 0.02 0.05 A2 0.55 0.65 0.80 A3 0.20 b 0.18 0.25 0.30 D 2.85 3.00 3.15 D2 2.20 2.70 E 2.85 3.00 3.15 E2 1.40 1.75 e 0.50 L 0.30 0.40 0.50 ddd 0.08 Note: VFDFPN stands for thermally enhanced very thin fine pitch dual flat packages. No lead. Very thin: 0.80 mm < A ≤ 1.00 mm / fine pitch: e < 1.00 mm STR485 DFN10 package information DS12713 - Rev 1 page 18/24 |
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