Electrical data

STSPIN233

6/22

DocID031111 Rev 1

2

Electrical data

2.1

Absolute maximum ratings

2.2

Recommended operating conditions

2.3

Thermal data

Table 1. Absolute maximum ratings

Symbol

Parameter

Test condition

Value

Unit

VS

Supply voltage

-

-0.3 to 11

V

VIN

Logic input voltage

-

-0.3 to 5.5

V

VOUT - VSENSE

Output to sense voltage drop

-

up to 12

V

VS - VOUT

Supply to output voltage drop

-

up to 12

V

VSENSE

Sense pins voltage

-

-1 to 1

V

IOUT,RMS

Continuous power stage output current

(each bridge)

-1.3

Arms

Tj

Junction temperature

-

-40 to 150

°C

TSTG

Storage temperature

-

-55 to 150

°C

Table 2. Recommended operating conditions

Symbol

Parameter

Test condition

Min.

Typ.

Max.

Unit

VS

Supply voltage

-

1.8

-

10

V

VIN

Logic input voltage

-

0

-

5

V

Table 3. Thermal data

Symbol

Parameter

Conditions

Value

Unit

RthJA

Junction to ambient thermal

resistance

Natural convection, according to

JESD51-2A(1)

1. Simulated on a 21.2 x 21.2 mm board, 2s2p 1 Oz copper and four 300 µm vias below the exposed pad.

57.1

°C/W

RthJCtop

Junction to case thermal resistance

(top side)

Simulation with cold plate on

package top

67.3

°C/W

RthJCbot

Junction to case thermal resistance

(bottom side)

Simulation with cold plate on

exposed pad

9.1

°C/W

RthJB

Junction to board thermal

resistance

according to JESD51-8(1)

23.3

°C/W

ΨJT

Junction to top characterization

According to JESD51-2A(1)

3.3

°C/W

ΨJB

Junction to board characterization

According to JESD51-2A(1)

22.6

°C/W