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STSPIN233 数据表(PDF) 20 Page - STMicroelectronics |
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STSPIN233 数据表(HTML) 20 Page - STMicroelectronics |
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20 / 22 page ![]() Package information STSPIN233 20/22 DocID031111 Rev 1 Figure 12. VFQFPN 3 x 3 x 1.0 16L recommended footprint Table 9. VFQFPN 3 x 3 x 1.0 16L package mechanical data(1) 1. VFQFPN stands for thermally enhanced “Very thin Fine pitch Quad Packages No lead”. Very thin: 0.80 < A ≤ 1.00 mm / fine pitch: e < 1.00 mm. The topside terminal A1 indicator may be a molded or metalized feature. The optional indicator on the bottom surface may be a molded, marked or metalized feature. Symbol Dimensions (mm) Notes Min. Typ. Max. A 0.80 0.90 1.00 - A1 0.00 0.02 0.005 (2) 2. A1 is defined as the distance from the seating plane to the lowest point on the package body (standoff). A3 - 0.20 REF. - - b 0.20 0.25 0.30 (3) 3. Dimensions “b” and “L” are measured at terminal plating surface. D3.00 BSC - D1 1.50 BSC - D2 1.70 1.80 1.90 - e0.50 BSC - E3.00 BSC - E1 1.50 BSC - E2 1.70 1.80 1.90 - L 0.30 0.40 0.50 (3) ddd 0.05 - |
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