7.6 Typical Characteristics (continued)

at TA = 25°C, VIN = VEN = VREF + 0.3 V, IL = 0 mA, CL = 10 µF, CIN = 0.1 µF (unless otherwise noted)

Frequency (Hz)

10

100

1000

10000

100000 1000000

1E+7

0

30

60

90

120

CIN=0.1F, CL=1F

Figure 7-25. Power Supply Rejection Ratio

(VREF = 2.5 V, IL = 0 mA)

Frequency (Hz)

10

100

1000

10000

100000 1000000

1E+7

0.05

1

10

100

1000

10000

CL = 0.1 F

CL = 1 F

CL = 10 F

Figure 7-26. Output Impedance

Temperature (

C)

-40

0

40

80

120

0

0.5

1

1.5

2

2.5

Figure 7-27. Quiescent Current vs Free-Air Temperature

Figure 7-28. Dropout Voltage vs Free-Air Temperature

Solder Heat Shift %

0

12

24

36

48

60

-0.03

-0.02

-0.01

0

0.01

0.02

0.03

Figure 7-29. Solder Heat Shift Distribution

Time (hr)

0

400

800

1200

1600

2000

-200

-160

-120

-80

-40

0

40

80

120

160

200

Figure 7-30. Long Term Stability - 2000 hours (VREF)

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REF35

SNAS809A – DECEMBER 2021 – REVISED AUGUST 2022

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