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REF35 数据表(PDF) 14 Page - Texas Instruments |
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REF35 数据表(HTML) 14 Page - Texas Instruments |
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14 / 35 page ![]() Time (hr) 0 400 800 1200 1600 2000 -200 -160 -120 -80 -40 0 40 80 120 160 200 Figure 8-5. Long Term Stability - 2000 hours (VREF) 8.4 Thermal Hysteresis Thermal hysteresis is measured with the REF35 soldered to a PCB, similar to a real-world application. Thermal hysteresis for the device is defined as the change in output voltage after operating the device at 25°C, cycling the device through the specified temperature range, and returning to 25°C. The PCB was baked at 150°C for 30 minutes before thermal hysteresis was measured. Use Equation 2 to calculate the thermal hysteresis: 6 PRE POST HYST NOM | V V | V 10 ppm V § · u ¨ ¸ © ¹ (2) where • VHYST = thermal hysteresis (in units of ppm) • VNOM = the specified output voltage • VPRE = output voltage measured at 25°C pre-temperature cycling • VPOST = output voltage measured after the device has cycled from 25°C through the specified temperature range of –40°C to +85°C or –40°C to +105°C and returns to 25°C. The graphs below show the typical thermal hysteresis distribution across various temperature ranges in two cycles. REF35 SNAS809A – DECEMBER 2021 – REVISED AUGUST 2022 www.ti.com 14 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: REF35 |
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