Data Sheet

ADM3061E/ADM3062E/ADM3063E/ADM3064E/

ADM3065E/ADM3066E/ADM3067E/ADM3068E

ABSOLUTE MAXIMUM RATINGS

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Rev. H | 8 of 25

Table 6.

Parameter

Rating

VCC to GND

6 V

VIO to GND

−0.3 V to +6 V

Digital Input and Output Voltage (DE, RE, DI, and RO)

−0.3 V to VIO1 + 0.3 V

Driver Output and Receiver Input Voltage

−9 V to +14 V

Operating Temperature Ranges

−40°C to +85°C

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Continuous Total Power Dissipation

8-Lead SOIC_N

0.225 W

8-Lead MSOP

0.151 W

10-Lead MSOP

0.151 W

10-Lead LFCSP

0.450 W

14-Lead SOIC_N

0.239 W

Maximum Junction Temperature (TJ)

150°C

Lead Temperature

Soldering (10 sec)

300°C

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

220°C

ESD on the Bus Pins (A, B, Y, Z)

IEC 61000-4-2 Contact Discharge

±12 kV

IEC 61000-4-2 Air Discharge

10 Positive and 10 Negative Discharges

≥±12 kV

Three Positive or Three Negative Discharges

±15 kV

ESD Human Body Model (HBM)

On the Bus Pins (A, B, Y, Z)

≥±30 kV

All Other Pins

±8 kV

1 VIO = VCC on the ADM3061E/ADM3063E/ADM3065E/ADM3067E.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure.

θJC is the junction to case thermal resistance.

Table 7. Thermal Resistance

Package Type

θJA1

θJC1

Unit

R-8

110.88

58.63

°C/W

RM-8

165.69

49.61

°C/W

RM-10

165.69

49.61

°C/W

R-14

104.5

42.90

°C/W

CP-10-9

55.65

33.22

°C/W

1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test

board with no bias. See JEDEC JESD-51.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.