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TOP250 数据表(PDF) 33 Page - Power Integrations, Inc. |
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TOP250 数据表(HTML) 33 Page - Power Integrations, Inc. |
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33 / 54 page ![]() Rev. R 10/20 33 TOP242-250 www.power.com Parameter Symbol Conditions SOURCE = 0 V; T J = -40 to 125 °C See Figure 53 (Unless Otherwise Specified) Min Typ Max Units CONTROL FUNCTIONS Switching Frequency (average) f OSC I C = 3 mA; T J = 25 °C FREQUENCY Pin Connected to SOURCE 124 132 140 kHz FREQUENCY Pin Connected to CONTROL 61.5 66 70.5 Duty Cycle at ONSET of Frequency Reduction DC (ONSET) 10 % Switching Frequency near 0% Duty Cycle f OSC(DMIN) 132 kHz Operation 30 kHz 66 kHz Operation 15 Frequency Jitter Deviation Df 132 kHz Operation ±4 kHz 66 kHz Operation ±2 Frequency Jitter Modulation Rate f M 250 Hz ABSOLUTE MAXIMUM RATINGS(1,4) DRAIN Voltage .................................. ................ -0.3 V to 700 V DRAIN Peak Current: TOP242......................................0.72 A TOP243......................................1.44 A TOP244......................................2.16 A TOP245......................................2.88 A TOP246 ..................................... 4.32 A TOP247 ..................................... 5.76 A TOP248 ..................................... 7.20 A TOP249 ..................................... 8.64 A TOP250 ................................... 10.08 A CONTROL Voltage .................................................-0.3 V to 9 V CONTROL Current........ ................................................ 100 mA LINE SENSE Pin Voltage ........................................ -0.3 V to 9 V CURRENT LIMIT Pin Voltage .............................. -0.3 V to 4.5 V MULTI-FUNCTION Pin Voltage ............................... -0.3 V to 9 V FREQUENCY Pin Voltage ...................................... -0.3 V to 9 V Storage Temperature ...................................... -65 °C to 150 °C Operating Junction Temperature(2) .................. -40 °C to 150 °C Lead Temperature(3) ...................................................... ..260 °C Notes: 1. All voltages referenced to SOURCE, T A = 25 °C. 2. Normally limited by internal circuitry. 3. 1/16 in. from case for 5 seconds. 4. Maximum ratings specified may be applied one at a time, ..... without causing permanent damage to the product. .............. Exposure to Absolute Maximum Rating conditions for ........... extended periods of time may affect product reliability. THERMAL RESISTANCE Thermal Resistance: Y or F Package: ( q JA) (1) ..................................................80 °C/W ( q JC) (2) ................................................... 2 °C/W P or G Package: ( q JA)................................. 70 °C/W (3) ; 60 °C/W(4) ( q JC) (5) ..................................................11 °C/W R Package: ( q JA)................80 °C/W (7) ; 40 °C/W(4); 30 °C/W(6) ( q JC) (5) ....................................................2 °C/W Notes: 1. Free standing with no heat sink. 2. Measured at the back surface of tab. 3. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad. 4. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad. 5. Measured on the SOURCE pin close to plastic interface. 6. Soldered to 3 sq. in. (1935 mm2), 2 oz. (610 g/m2) copper clad. 7. Soldered to foot print area, 2 oz. (610 g/m2) copper clad. |
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