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AX88780 数据表(PDF) 39 Page - ASIX Electronics Corporation |
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AX88780 数据表(HTML) 39 Page - ASIX Electronics Corporation |
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39 / 49 page ![]() AX88780 6.1.8 Power Consumption Symbol Description Min Typ Max Units Current consumption of VCC2, 2.5V Power On with auto-negotiation - 220 - mA Current consumption of VCC2, 2.5V 10M with traffic - 200 - mA IVCC2 Current consumption of VCC2, 2.5V 100M with traffic - 157 - mA Current consumption of VCC3, 3.3V Power On with auto-negotiation - 2.5 - mA Current consumption of VCC3, 3.3V 10M with traffic - 2.5 - mA IVCC3 Current consumption of VCC3, 3.3V 100M with traffic - 2.7 - mA Note Based on 125M HCLK reference clock 6.1.9 Thermal Characteristics A. Testing Condition Environment PCB Layer (2S2P) 4 Maximum junction temperature (oC) -- TJ 125 Ambient temperature (oC) -- TA 65 Input Power (W) -- P 1 B. Junction to ambient thermal resistance Symbol Min Typ Max Units JA θ (0 m/s airflow)1 - 46.3 - oC/W JA θ (1 m/s airflow) - 40.3 - oC/W JA θ (2 m/s airflow) - 38.6 - oC/W JA θ (3 m/s airflow) - 37.5 - oC/W 1: Note JA θ defined as below JA θ = P T T A J − JA θ : thermal resistance TJ : junction temperature TA: ambient temperature P : input power (watts) TJ = TA + (P X JA θ ) C. Power Dissipation Air Flow (m/s) 0 1 2 3 Power Dissipation (watt) 1.29 1.48 1.55 1.6 39 ASIX ELECTRONICS CORPORATION |
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