MCP6L91RTESLASHMS datasheet(29/40 Pages) MICROCHIP

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 2009-2019 Microchip Technology Inc.

DS20002141C-page 29

MCP6L91/1R/2/4

Microchip Technology Drawing No. C04-065-SL Rev D Sheet 2 of 2

14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Foot Angle

0°

8°

15°

5°

Mold Draft Angle Bottom

15°

5°

Mold Draft Angle Top

0.51

0.31

Lead Width

0.25

0.10

Lead Thickness

1.04 REF

Footprint

0.50

0.25

Chamfer (Optional)

8.65 BSC

Overall Length

3.90 BSC

Molded Package Width

6.00 BSC

Overall Width

0.25

0.10

Standoff

1.25

Molded Package Thickness

1.75

Overall Height

1.27 BSC

Pitch

Number of Pins

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

Units

Foot Length

0.40

1.27

or protrusion, which shall not exceed 0.25 mm per side.

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimension D does not include mold flash, protrusions or gate burrs, which shall

Pin 1 visual index feature may vary, but must be located within the hatched area.

§ Significant Characteristic

Dimensioning and tolerancing per ASME Y14.5M

not exceed 0.15 mm per end. Dimension E1 does not include interlead flash

5. Datums A & B to be determined at Datum H.

Lead Angle

0°

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